MPX2300DT1 mpx2301dt1 1 sensor device data freescale semiconductor high volume pressure sensor for disposable applications freescale semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit. the unique concept of the chip pak allows great flexibility in system design while allowing an economic solution for the designer. this new chip carrier package uses freescale semiconductor?s unique sensor die with its pi ezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration. note: freescale semiconductor is also offering the chip pak package in application--specific configurations, which will have an ?spx? prefix, followed by a four--digit number, unique to the specific customer. features ? low cost ? integrated temperature compensation and calibration ? ratiometric to supply voltage ? polysulfone case material (medical, class v approved) ? provided in easy--to--use tape and reel application examples ? medical diagnostics ? infusion pumps ? blood pressure monitors ? pressure catheter applications ? patient monitoring note: the die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). front side die and wire protection must be provided in the customer?s housing. use caution when handling the devices during all processes. freescale semiconductor?s MPX2300DT1/ mpx2301dt1 pressure sensors have been designed for medical usage by combining the performance of freescale semiconductor?s shear stress pressure sensor design and the use of biomedically approved materials. materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. it can be sterilized using ethylene oxide. the portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. the rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, usp. a silicone dielectric gel covers the silicon piezoresistive sensing element. the gel is a nontoxic, nonallergenic elasto- mer system which meets all usp xx biological testing class v requirements. the properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. the gel provides electrical isolation sufficient to withstand defibrillation testing, as speci- fied in the proposed association for the advancement of medical instrumentation (aami) standard for blood pressure transducers. a biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the per- formance of the sensor. the mpx2301dt1 is a reduced gel option. preferred devices are freescale semiconductor recommended choices for future use and best overall value. MPX2300DT1 rev. 6, 10/2004 freescale semiconductor technical data ? freescale semiconductor, inc., 2004. all rights reserved. MPX2300DT1 mpx2301dt1 pressure sensors 0to300mmhg(0to40kpa) pin number mpx2300/1dt1 case 423a 1 2 v s s+ 3 4 s-- gnd freescale semiconductor preferred device chip pak package
2 sensor device data freescale semiconductor MPX2300DT1 mpx2301dt1 maximum ratings (note) rating symbol value unit maximum pressure (backside) p max 125 psi storage temperature t stg -- 2 5 t o + 8 5 c operating temperature t a +15to+40 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s =6vdc,t a =25 c unless otherwise noted) characteristics symbol min typ max unit pressure range p op 0 ? 300 mmhg supply voltage (7) v s ? 6.0 10 vdc supply current i o ? 1.0 ? madc zero pressure offset v off --0.75 ? 0.75 mv sensitivity ? 4.95 5.0 5.05 v/v/mmhg full scale span (1) v fss 2.976 3.006 3.036 mv linearity + hysteresis (2) ? -- 1 . 5 ? 1.5 %v fss accuracy (9) v s = 6 v, p = 101 to 200 mmhg ? -- 1 . 5 ? 1.5 % accuracy (9) v s = 6 v, p = 201 to 300 mmhg ? -- 3 . 0 ? 3.0 % temperature effect on sensitivity tcs -- 0 . 1 ? +0.1 %/ c temperature effect on full scale span (3) tcv fss -- 0 . 1 ? +0.1 %/ c temperature effect on offset (4) tcv off -- 9 . 0 ? +9.0 v/ c input impedance z in 1800 ? 4500 ? output impedance z out 270 ? 330 ? r cal (150 k ? ) (8) r cal 97 100 103 mmhg response time (5) (10% to 90%) t r ? 1.0 ? ms temperature error band ? 0 ? 85 c stability (6) ? ? 0.5 ? %v fss notes: 1. measured at 6.0 vdc excitation for 100 mmhg pressure differential. v fss and fss are like terms representing the algebraic difference between full scale output and zero pressure offset. 2. maximum deviation from end--point straight line fit at 0 and 200 mmhg. 3. slope of end--point straight line fit to full scale span at 15 c and +40 c relative to +25 c. 4. slope of end--point straight line fit to zero pressure offset at 15 c and +40 c relative to +25 c. 5. for a 0 to 300 mmhg pressure step change. 6. stability is defined as the maximum difference in output at any pressure within p op and temperature within +10 cto+85 cafter: a. 1000 temperature cycles, --40 c to +125 c. b. 1.5 million pressure cycles, 0 to 300 mmhg. 7. recommended voltage supply: 6 v 0.2 v, regulated. sensor output is ratiometric to the voltage supply. supply voltages above +10 v may induce additional error due to device self--heating. 8. offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to v s and s+ output. 9. accuracy is calculated using the following equation: error p ={[v p -- offset)/(sens nom *v ex )]--p}/p where: v p = actual output voltage at pressure p in microvolts ( v) offset = voltage output at p = 0mmhg in microvolts ( v) sens nom = nominal sensitivity = 5.01 v/v/mmhg v ex = excitation voltage p = pressure applied to the device
MPX2300DT1 mpx2301dt1 3 sensor device data freescale semiconductor ordering information the MPX2300DT1/mpx2301dt1 silicon pressure sens ors are available in tape and reel packaging. device type/order no. case no. device description marking MPX2300DT1 423a chip pak, full gel date code, lot id mpx2301dt1 423a chip pak, 1/3 gel date code, lot id packaging information reel size tape width quantity tape and reel 330 mm 24 mm 1000 pc/reel package dimensions case 423a--03 issue c dim a min max min max millimeters 6.10 6.60 0.240 0.260 inches b 8.89 9.40 0.350 0.370 c 3.56 3.81 0.140 0.150 d1 0.30 0.51 0.012 0.020 e 2.24 2.59 0.088 0.102 f 3.12 3.25 0.123 0.128 g 1.14 1.40 0.045 0.055 h 0.94 1.19 0.037 0.047 j 0.18 0.28 0.007 0.011 k 3.05 3.56 0.120 0.140 l 2.41 2.67 0.095 0.105 m 4.19 4.45 0.165 0.175 n 5.66 6.07 0.223 0.239 v 2.67 2.92 0.105 0.115 aa 2.41 2.72 0.095 0.107 ab 0.38 0.89 0.015 0.035 ac 3.05 4.45 0.120 0.175 ad 2.54 2.92 0.100 0.115 notes: 10. dimensioning and tolerancing per ansi y14.5m, 1982. 11. controlling dimension: inch. style 1: pin 1. v cc 2. +out 3. --out 4. ground ab ad aa f ac back view g d1 v n front view m a 12 4 3 c l b f k h e j -- t -- end view d2 detail a detail a d2 0.36 0.56 0.014 0.022
4 sensor device data freescale semiconductor MPX2300DT1 mpx2301dt1 information in this document is provided solely to enable system and software implementers to use freescale semiconductor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products fo r any particular purpose, nor does freescale semiconductor assume any liability arising out of t he application or use of any product or circuit, and specifically disclaims any and all liabilit y, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale semiconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemnify and hold freescale semiconductor and its officers, employees, subsid iaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale t and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2004. all rights reserved. how to reach us: home page: www.freescale.com e--mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1--800--521--6274 or +1--480--768--2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33169354848(french) support@freescale.com japan: freescale semiconductor japan ltd. technical information center 3--20--1, minami--azabu, minato--ku tokyo 106--0047, japan 0120 191014 or +81 3 3440 3569 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center p.o. box 5405 denver, colorado 80217 1--800--441--2447 or 303--675--2140 fax: 303--675--2150 ldcforfreescalesemiconductor@hibbertgroup.com MPX2300DT1 rev. 6 10/2004
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